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A 3-D Chip Architecture for Optical Sensing and Concurrent Processing


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Author: Rodríguez Vázquez, Ángel Benito
Carmona Galán, Ricardo
Domínguez Matas, Carlos
Suárez Cambre, Manuel
Brea, Víctor M.
Pozas, Francisco
Liñán Cembrano, Gustavo
Foldessy, Peter
Zarandy, Akos
Rekeczky, Csaba
Department: Universidad de Sevilla. Departamento de Electrónica y Electromagnetismo
Date: 2010
Published in: Proceedings of SPIE, 7726, 772613.
Document type: Article
Abstract: This paper presents an architecture for the implementation of vision chips in 3-D integration technologies. This architecture employs the multi-functional pixel concept to achieve full parallel processing of the information and hence high processing speed. The top layer includes an array of optical sensors which are parallel-connected to the second layer, consisting of an array of mixed-signal read-out and pre-processing cells. Multiplexing is employed so that each mixedsignal cell handles several optical sensors. The two remaining layer are respectively a memory (used to store different multi-scale images obtained at the mixed-signal layer) and an array of digital processors. A prototype of this architecture has been implemented in a FDSOI CMOS-3D technology with Through-Silicon-Vias of 5μm x 5μm pitch.
Cite: Rodríguez Vázquez, Á.B., Carmona Galán, R., Domínguez Matas, C., Suárez Cambre, M., Brea, V.M., Pozas, F.,...,Rekeczky, C. (2010). A 3-D Chip Architecture for Optical Sensing and Concurrent Processing. Proceedings of SPIE, 7726, 772613.
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DOI: 10.1117/12.855027

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