Ponencia
Digital processor array implementation aspects of a 3D multi-layer vision architecture
Autor/es | Földesy, Peter
Carmona Galán, Ricardo Rekeczky, Csaba Zarandy, A. Rodríguez Vázquez, Ángel Benito Roska, Tamás |
Departamento | Universidad de Sevilla. Departamento de Electrónica y Electromagnetismo |
Fecha de publicación | 2010 |
Fecha de depósito | 2019-09-03 |
Publicado en |
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ISBN/ISSN | 978-1-4244-6679-5 |
Resumen | Technological aspects of the 3D integration of a multilayer combined mixed-signal and digital sensor-processor array chip is described. The 3D integration raises the question of signal routing, power distribution, and heat ... Technological aspects of the 3D integration of a multilayer combined mixed-signal and digital sensor-processor array chip is described. The 3D integration raises the question of signal routing, power distribution, and heat dissipation, which aspects are considered systematically in the digital processor array layer as part of the multi layer structure. We have developed a linear programming based evaluation system to identify the proper architecture and its parameters. |
Identificador del proyecto | N00173-08-C-4005 VISCUBE |
Cita | Földesy, P., Carmona Galán, R., Rekeczky, C., Zarandy, A., Rodríguez Vázquez, Á.B. y Roska, T. (2010). Digital processor array implementation aspects of a 3D multi-layer vision architecture. En 12th International Workshop on Cellular Nanoscale Networks and Their Applications (CNNA) (1-4), Berkeley (USA): Institute of Electrical and Electronics Engineers. |
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