dc.creator | Rodríguez Vázquez, Ángel Benito | es |
dc.creator | Carmona Galán, Ricardo | es |
dc.creator | Fernández Berni, Jorge | es |
dc.creator | Vargas Sierra, Sonia | es |
dc.creator | Leñero Bardallo, Juan Antonio | es |
dc.creator | Suárez Cambre, Manuel | es |
dc.creator | Brea Sánchez, Víctor Manuel | es |
dc.creator | Pérez Verdú, Belén | es |
dc.date.accessioned | 2018-09-11T13:49:20Z | |
dc.date.available | 2018-09-11T13:49:20Z | |
dc.date.issued | 2014 | |
dc.identifier.citation | Rodríguez Vázquez, Á.B., Carmona Galán, R., Fernández Berni, J., Vargas Sierra, S., Leñero Bardallo, J.A., Suárez Cambre, M.,...,Pérez Verdú, B. (2014). Form Factor Improvement of Smart-Pixels for Vision Sensors through 3-D Vertically- Integrated Technologies. | |
dc.identifier.uri | https://hdl.handle.net/11441/78418 | |
dc.description.abstract | While conventional CMOS active pixel sensors embed only the circuitry required for photo-detection, pixel addressing and voltage buffering, smart pixels incorporate also circuitry for data processing, data storage and control of data interchange. This additional circuitry enables data processing be realized concurrently with the acquisition of images which is instrumental to reduce the number of data needed to carry to information contained into images. This way, more efficient vision systems can be built at the cost of larger pixel pitch. Vertically-integrated 3D technologies enable to keep the advnatges of smart pixels while improving the form factor of smart pixels. | es |
dc.description.sponsorship | Office of Naval Research N000141110312 | es |
dc.description.sponsorship | Ministerio de Ciencia e Innovación IPT-2011-1625-430000 | es |
dc.format | application/pdf | es |
dc.language.iso | eng | es |
dc.publisher | Institute of Electrical and Electronics Engineers | es |
dc.rights | Attribution-NonCommercial-NoDerivatives 4.0 Internacional | * |
dc.rights.uri | http://creativecommons.org/licenses/by-nc-nd/4.0/ | * |
dc.title | Form Factor Improvement of Smart-Pixels for Vision Sensors through 3-D Vertically- Integrated Technologies | es |
dc.type | info:eu-repo/semantics/conferenceObject | es |
dcterms.identifier | https://ror.org/03yxnpp24 | |
dc.type.version | info:eu-repo/semantics/acceptedVersion | es |
dc.rights.accessRights | info:eu-repo/semantics/openAccess | es |
dc.contributor.affiliation | Universidad de Sevilla. Departamento de Electrónica y Electromagnetismo | es |
dc.relation.projectID | N000141110312 | es |
dc.relation.projectID | IPT-2011-1625-430000 | es |
dc.relation.publisherversion | http://dx.doi.org/10.1109/LASCAS.2014.6820327 | es |
dc.identifier.doi | 10.1109/LASCAS.2014.6820327 | es |
idus.format.extent | 4 p. | es |
dc.publication.initialPage | 1 | es |
dc.publication.endPage | 4 | es |
dc.eventtitle | IEEE Latin American Symposium on Circuits and Systems (LASCAS) | es |
dc.eventinstitution | Santiago, Chile | es |
dc.contributor.funder | Office of Naval Research (ONR). United States | |
dc.contributor.funder | Ministerio de Ciencia e Innovación (MICIN). España | |