Article
Stress reduction in a-C:H coatings through the addition of nitrogen to the feed gas
Author/s | Rabbani, F.
Escobar-Galindo, Ramón ![]() ![]() ![]() ![]() ![]() ![]() ![]() Arnoldbik, W.M. Zwaag, S. van der Veen, A. van Schut, Henk |
Department | Universidad de Sevilla. Departamento de Física Aplicada I |
Publication Date | 2004-09 |
Deposit Date | 2023-07-04 |
Published in |
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Abstract | Intrinsic stress in amorphous hydrogenated carbon (a-C:H) coatings was reduced through addition of 10–20 sccm N2 to the feed gas. The compressive stresses observed in this study were in the range −0.91 to −1.6 GPa. ... Intrinsic stress in amorphous hydrogenated carbon (a-C:H) coatings was reduced through addition of 10–20 sccm N2 to the feed gas. The compressive stresses observed in this study were in the range −0.91 to −1.6 GPa. Approximately 2–3 at.% nitrogen was incorporated into the coatings as determined using elastic recoil detection (ERD). Raman spectroscopy shows that the G peak of samples made with nitrogen is shifted to higher wave numbers, and that there is a more pronounced ‘shoulder’ at the D peak position. It is hypothesized that nitrogen addition to the feed gas at a flow rate of 20 sccm enhances the formation of aromatic rings associated with the D peak. The stress reduction noted for nitrogen addition at 10 sccm was contributed to a reduction in the mean coordination number of the network. Positron beam analysis (PBA) was used to show that in a high temperature deposition the interface of the nitrogen-containing coating has more open space. This phenomenon can contribute to a reduction of the compressive stress by reducing the interfacial stress. Annealing tests were performed to monitor this open volume using Raman and PBA analysis. |
Citation | Rabbani, F., Escobar-Galindo, R., Arnoldbik, W.M., Zwaag, .v.d., Veen, A.v. y Schut, H. (2004). Stress reduction in a-C:H coatings through the addition of nitrogen to the feed gas. Diamond and Related Materials, 13 (9), 1645-1657. https://doi.org/10.1016/j.diamond.2004.02.003. |
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