dc.creator | Távara Mendoza, Luis Arístides | es |
dc.creator | Mantic, Vladislav | es |
dc.creator | Graciani Díaz, Enrique | es |
dc.creator | Cañas Delgado, José | es |
dc.creator | París Carballo, Federico | es |
dc.date.accessioned | 2018-04-05T14:08:08Z | |
dc.date.available | 2018-04-05T14:08:08Z | |
dc.date.issued | 2010 | |
dc.identifier.citation | Távara Mendoza, L.A., Mantic, V., Graciani Díaz, E., Cañas Delgado, J. y París Carballo, F. (2010). Analysis of a Crack in a Thin Adhesive Layer between Orthotropic Materials: An Application to Composite Interlaminar Fracture Toughness Test. Computer Modeling in Engineering & Sciences, 58 (3), 247-270. | |
dc.identifier.issn | 1526-1492 | es |
dc.identifier.uri | https://hdl.handle.net/11441/72026 | |
dc.description.abstract | The problem of a crack in a thin adhesive layer is considered. The adherents
may have orthotropic elastic behavior which allows composite laminates to
be modeled. In the present work a linear elastic-brittle constitutive law of the thin
adhesive layer, called weak interface model, is adopted, allowing an easy modeling
of crack propagation along it. In this law, the normal and tangential stresses across
the undamaged interface are proportional to the relative normal and tangential displacements,
respectively. Interface crack propagation is modeled by successive
breaking of the springs used to discretize the weak interface. An important feature
of the BEM approach developed is that the behavior of the springs is independent
of the boundary element mesh, (i.e. distance between springs and boundary element
types used). This fact allows, for example, an easy mesh refinement to be
performed. The present model allows not only the crack propagation but also the
crack initiation to be studied. The problem of two linear elastic half-planes bonded
by a cracked thin adhesive layer is considered first. A formulation of the new governing
integral equation for two identical orthotropic half-planes bonded along a
straight weak interface including a finite interface crack under constant pressure is
presented, introducing a new dimensionless characteristic structural parameter d. A
parametric study of this problem by BEM is presented, verifying the correct implementation
of the weak interface model. Then, the Interlaminar Fracture Toughness
(GIc) Test is analyzed by the BEM code developed. The crack propagation is studied
by a new Energy Release Rate criterion. It is shown that the weak interface
model of the adhesive layer, used in the 2D Boundary Element Method (BEM)
code developed, provides a good representation of the actual adhesive behavior by
comparing numerical and experimental results. | es |
dc.description.sponsorship | Junta de Andalucía TEP-1207 | es |
dc.description.sponsorship | Junta de Andalucía TEP-2045 | es |
dc.description.sponsorship | Junta de Andalucía TEP-4051 | es |
dc.description.sponsorship | Ministerio de Educación y Ciencia TRA2005-06764 | es |
dc.description.sponsorship | Ministerio de Educación y Ciencia TRA2006-08077 | es |
dc.format | application/pdf | es |
dc.language.iso | eng | es |
dc.publisher | Tech Science Press | es |
dc.relation.ispartof | Computer Modeling in Engineering & Sciences, 58 (3), 247-270. | |
dc.rights | Attribution-NonCommercial-NoDerivatives 4.0 Internacional | * |
dc.rights.uri | http://creativecommons.org/licenses/by-nc-nd/4.0/ | * |
dc.subject | Crack | es |
dc.subject | BEM | es |
dc.subject | Delamination | es |
dc.title | Analysis of a Crack in a Thin Adhesive Layer between Orthotropic Materials: An Application to Composite Interlaminar Fracture Toughness Test | es |
dc.type | info:eu-repo/semantics/article | es |
dc.type.version | info:eu-repo/semantics/publishedVersion | es |
dc.rights.accessRights | info:eu-repo/semantics/openAccess | es |
dc.contributor.affiliation | Universidad de Sevilla. Departamento de Mecánica de Medios Continuos y Teoría de Estructuras | es |
dc.relation.projectID | TEP-1207 | es |
dc.relation.projectID | TEP-2045 | es |
dc.relation.projectID | TEP-4051 | es |
dc.relation.projectID | TRA2005-06764 | es |
dc.relation.projectID | TRA2006-08077 | es |
dc.relation.publisherversion | http://www.techscience.com/cmes/2010/v58n3_index.html | es |
dc.identifier.doi | 10.3970/cmes.2010.058.247 | es |
idus.format.extent | 24 p. | es |
dc.journaltitle | Computer Modeling in Engineering & Sciences | es |
dc.publication.volumen | 58 | es |
dc.publication.issue | 3 | es |
dc.publication.initialPage | 247 | es |
dc.publication.endPage | 270 | es |
dc.identifier.sisius | 6608387 | es |