Artículo
An investigation of silicon carbide-water nanofluid for heat transfer applications
Autor/es | Singh, D.
Timofeeva, E. Yu, W. Routbort, Jules France, D. Smith, D. López-Cepero Borrego, José Manuel |
Departamento | Universidad de Sevilla. Departamento de Física de la Materia Condensada |
Fecha de publicación | 2009 |
Fecha de depósito | 2019-10-22 |
Publicado en |
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Resumen | Thermal conductivity and mechanical effects of silicon carbide nanoparticles uniformly dispersed in
water were investigated. Mean size of SiC particles was 170 nm with a polydispersity of 30% as
determined from small-angle ... Thermal conductivity and mechanical effects of silicon carbide nanoparticles uniformly dispersed in water were investigated. Mean size of SiC particles was 170 nm with a polydispersity of 30% as determined from small-angle x-ray scattering and dynamic light scattering techniques. Room temperature viscosity of the nanofluids ranged from 2 to 3 cP for nominal nanoparticle loadings 4 – 7 vol %. On a normalized basis with water, viscosity of the nanofluids did not significantly change with the test temperature up to 85 °C. Optical microscopy of diluted nanofluid showed no agglomeration of the nanoparticles. Thermal conductivity of the fluid was measured as a function of the nominal nanoparticle loading ranging from 1 to 7 vol %. Enhancement in thermal conductivity was approximately 28% over that of water at 7 vol % particle loadings under ambient conditions. Enhancements in thermal conductivities for the nanofluids with varying nanoparticle loadings were maintained at test temperatures up to 70 °C. Results of thermal conductivity have been rationalized based on the existing theories of heat transfer in fluids. Implications of using this nanofluid for engineering cooling applications are discussed. |
Identificador del proyecto | DE-AC02-06CH11357 |
Cita | Singh, D., Timofeeva, E., Yu, W., Routbort, J., France, D., Smith, D. y López-Cepero Borrego, J.M. (2009). An investigation of silicon carbide-water nanofluid for heat transfer applications. Journal of Applied Physics, 105 (6), 064306. |
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