dc.creator | Perdigones Sánchez, Francisco | es |
dc.creator | Quero Reboul, José Manuel | es |
dc.date.accessioned | 2022-07-01T17:00:30Z | |
dc.date.available | 2022-07-01T17:00:30Z | |
dc.date.issued | 2022-03 | |
dc.identifier.citation | Perdigones Sánchez, F. y Quero Reboul, J.M. (2022). Printed Circuit Boards: The Layers’ Functions for Electronic and Biomedical Engineering. Micromachines, 13 (3), 460. | |
dc.identifier.issn | 2072-666X | es |
dc.identifier.uri | https://hdl.handle.net/11441/134933 | |
dc.description.abstract | This paper describes the fabrication opportunities that Printed Circuit Boards (PCBs)
offer for electronic and biomedical engineering. Historically, PCB substrates have been used to
support the components of the electronic devices, linking them using copper lines, and providing
input and output pads to connect the rest of the system. In addition, this kind of substrate is an
emerging material for biomedical engineering thanks to its many interesting characteristics, such as
its commercial availability at a low cost with very good tolerance and versatility, due to its multilayer
characteristics; that is, the possibility of using several metals and substrate layers. The alternative
uses of copper, gold, Flame Retardant 4 (FR4) and silver layers, together with the use of vias, solder
masks and a rigid and flexible substrate, are noted. Among other uses, these characteristics have
been using to develop many sensors, biosensors and actuators, and PCB-based lab-on chips; for
example, deoxyribonucleic acid (DNA) amplification devices for Polymerase Chain Reaction (PCR).
In addition, several applications of these devices are going to be noted in this paper, and two tables
summarizing the layers’ functions are included in the discussion: the first one for metallic layers, and
the second one for the vias, solder mask, flexible and rigid substrate functions. | es |
dc.description.sponsorship | Junta de Andalucía-Consejería de Economía y Conocimiento P18-RT-1745 | es |
dc.description.sponsorship | Universidad de Sevilla | es |
dc.format | application/pdf | es |
dc.format.extent | 33 p. | es |
dc.language.iso | eng | es |
dc.publisher | MDPI | es |
dc.relation.ispartof | Micromachines, 13 (3), 460. | |
dc.rights | Attribution-NonCommercial-NoDerivatives 4.0 Internacional | * |
dc.rights.uri | http://creativecommons.org/licenses/by-nc-nd/4.0/ | * |
dc.subject | Printed Circuit Board (PCB) | es |
dc.subject | Biomedical | es |
dc.subject | Electronic | es |
dc.subject | Engineering | es |
dc.title | Printed Circuit Boards: The Layers’ Functions for Electronic and Biomedical Engineering | es |
dc.type | info:eu-repo/semantics/article | es |
dcterms.identifier | https://ror.org/03yxnpp24 | |
dc.type.version | info:eu-repo/semantics/publishedVersion | es |
dc.rights.accessRights | info:eu-repo/semantics/openAccess | es |
dc.contributor.affiliation | Universidad de Sevilla. Departamento de Ingeniería Electrónica | es |
dc.relation.projectID | P18-RT-1745 | es |
dc.relation.publisherversion | https://www.mdpi.com/2072-666X/13/3/460 | es |
dc.identifier.doi | 10.3390/mi13030460 | es |
dc.journaltitle | Micromachines | es |
dc.publication.volumen | 13 | es |
dc.publication.issue | 3 | es |
dc.publication.initialPage | 460 | es |