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Ponencia
3D multi-layer vision architecture for surveillance and reconnaissance applications
(Institute of Electrical and Electronics Engineers, 2009)
The architecture and the design details of a multilayer combined mixed-signal and digital sensor-processor array chip is shown. The processor layers are fabricated with 3D integration technology, and the sensor layer is ...
Artículo
ECCTD 2007 special issue 'bridging technology innovations to foundations'
(Wiley-Blackwell, 2009)
Artículo
Accurate Settling-Time Modeling and Design Procedures for Two-Stage Miller-Compensated Amplifiers for Switched-Capacitor Circuits
(Institute of Electrical and Electronics Engineers, 2009)
We present modeling techniques for accurate estimation of settling errors in switched-capacitor (SC) circuits built with Miller-compensated operational transconductance amplifiers (OTAs). One distinctive feature of the ...
Ponencia
A low-power reconfigurable ADC for biomedical sensor interfaces
(Institute of Electrical and Electronics Engineers, 2009)
This paper presents a 12-bit low-voltage low-power reconfigurable Analog-to-Digital Converter (ADC). The design employs Switched Capacitor (SC) techniques and implements a Successive Approximation (SA) algorithm. The ...
Artículo
Integrated Circuitry to Detect Slippage Inspired by Human Skin and Artificial Retinas
(Institute of Electrical and Electronics Engineers, 2009)
This paper presents a bioinspired integrated tactile coprocessor that is able to generate a warning in the case of slippage via the data provided by a tactile sensor. Some implementations use different layers of piezoresistive ...